Chip Price & Supply Chain
Singapore's Chip Technology Breakthrough: Three Major Innovation Directions in the Second Half of 2026 Lead the New Global Semiconductor Cycle
This analysis examines technological breakthroughs in Singapore's semiconductor industry for H2 2026, focusing on advances in AI chips, advanced packaging, and quantum computing, a
August 22, 2026Singapore's New AI Chip Strategy Layout: Rise of Global Innovation Hub
Singapore is building a global AI chip innovation hub through three pillars: policy guidance, industry clustering, and t
August 20, 2026
AI Chip Frontier: Technological Breakthroughs and Market Restructuring in the Second Half of 2026
In the second half of 2026, the global AI chip industry will usher in a new round of technological breakthroughs and mar
August 14, 2026
New Layout of Singapore's AI Chip Strategy: Rise of a Global Innovation Hub
Singapore is accelerating its layout in the AI chip industry, building a global AI chip innovation hub through policy su
August 11, 2026
AI Chip Frontier: Technological Breakthroughs and Market Restructuring in the Second Half of 2026
With the deep penetration of AI applications, AI chip technology is undergoing unprecedented changes. This article provi
August 9, 2026
Singapore wafer fab utilization hits two-year high, signaling mature node foundry recovery
Latest industry data shows that in July 2026, capacity utilization at major wafer foundries in Singapore and Southeast A
August 5, 2026
AI demand sparks semiconductor market rebound, global chip sales to hit new record in Q2 2026
Global semiconductor sales grew by 18.6% year-on-year in the second quarter of 2026, reaching a record high. The main dr
July 31, 2026
World's First Edge AI RISC-V Chip Launched, Chinese Firms Seize New Architecture High Ground
On July 28, 2026, Chinese chip design company SaiWuJi released the world's first RISC-V AI chip for edge computing, SWJ-
July 28, 2026
EU launches 2nd phase of Chips Act with €12B to boost local manufacturing
The European Commission announced today the launch of the Chips Act Phase 2, with a total investment of €12 billion, foc
July 27, 2026
Memory Chip Giants Question Hybrid Bonding Technology
Samsung and SK Hynix question hybrid bonding technology, a key path for 3D stacked memory chips. This article analyzes t
July 15, 2026
